Top Mark Diagram:

MEDIATEK ARM MT9286BAATAB YYWW-ZAC$H C#### 34EA#### 34EA#### .

Description:  YYWW:Date Code  $:Subcontractor Code  ####:Lot No. of U1~U10  (U1~U10 Definition Follows Bonding Diagram)  ꇵ:Space  %%: wafer ID for WLCSP recon wafer ID or panel ID for MiFO WLCSP  @@@@@:Sequence no.(1st @ is empty for POP package)

This is a Simplified Top Mark Diagram(Does not contain the Font and Mark format) Format: RTXXXX/CLXXXX/TCXXXX Refer to MediaTek W-173<Instruction of IC Packgae Marking Operation>;Pin#1 location of RTXXXX/CLXXXX/TCXXXX is different from simplified top mark diagram.Please be specially noted and follow W-173 exactly. MTXXXX and others Refer to MediaTek W-074<Mark Instruction of IC Package Marking Operation> If BDRF issue company is ECNS, please keep original IC logo and brand. But top mark font and size refers to ECONET ISO doc. 3-Q-MFE-002 which can be requested from ECONET DCC