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Top Mark Diagram:
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MEDIATEK
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ARM
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MT9286BAATAB |
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YYWW-ZAC$H |
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C#### |
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34EA#### |
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34EA#### |
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Description:
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YYWW:Date Code
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$:Subcontractor Code
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####:Lot No. of U1~U10
(U1~U10 Definition Follows Bonding Diagram)
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ꇵ:Space
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%%:
wafer ID for WLCSP
recon wafer ID or panel ID for MiFO WLCSP
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@@@@@:Sequence no.(1st @ is empty for POP package)
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This is a Simplified Top Mark Diagram(Does not contain the Font and Mark
format)
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Format:
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RTXXXX/CLXXXX/TCXXXX Refer to MediaTek W-173<Instruction of IC Packgae
Marking
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Operation>;Pin#1 location of RTXXXX/CLXXXX/TCXXXX is different from
simplified top
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mark diagram.Please be specially noted and follow W-173 exactly.
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MTXXXX and others Refer to MediaTek W-074<Mark Instruction of IC Package
Marking
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Operation>
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If BDRF issue company is ECNS, please keep original IC logo and brand. But
top mark font
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and size refers to ECONET ISO doc. 3-Q-MFE-002 which can be requested from
ECONET DCC
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